Ferdinand Arabe
6Patents
2h-index
8Co-inventors
36Inventor score
Filing activity: Jul 21, 2000 → Mar 13, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6552430B1 | Ball grid array substrate with improved traces formed from copper based metal | Electricity | 56 | Expired |
| US6271109A | Substrate for accommodating warped semiconductor devices | Emerging Cross-Sectional Technologies | 7 | Expired |
| US7550314B2 | Patterned plasma treatment to improve distribution of underfill material | Electricity | 2 | Active |
| US7045904B2 | Patterned plasma treatment to improve distribution of underfill material | Electricity | 1 | Expired |
| US6455350B1 | Methods and apparatus for manufacturing ball grid array semiconductor device packages | Electricity | 1 | Expired |
| US6683371B2 | Methods of and apparatus for manufacturing ball grid array semiconductor device packages | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.