Gary E. Dickerson
11Patents
3h-index
16Co-inventors
53Inventor score
Filing activity: Oct 21, 2010 → Dec 13, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9530674B2 | Method and system for three-dimensional (3D) structure fill | Electricity | 7 | Active |
| US9646893B2 | Method and apparatus for reducing radiation induced change in semiconductor structures | Electricity | 3 | Active |
| US9620407B2 | 3D material modification for advanced processing | Electricity | 3 | Active |
| US10943779B2 | Method and system for three-dimensional (3D) structure fill | Electricity | 1 | Active |
| US10377665B2 | Modifying bulk properties of a glass substrate | Chemistry; Metallurgy | 0 | Active |
| US11781100B2 | All-in-one bioreactor for therapeutic cells manufacturing | Chemistry; Metallurgy | 0 | Active |
| US9978620B2 | Method and apparatus for reducing radiation induced change in semiconductor structures | Electricity | 0 | Active |
| US9773675B2 | 3D material modification for advanced processing | Electricity | 0 | Active |
| US8718733B2 | Superconducting fault current limiter recovery system | Emerging Cross-Sectional Technologies | 0 | Active |
| US8487280B2 | Modulating implantation for improved workpiece splitting | Electricity | 0 | Active |
| US12094726B2 | Adapting electrical, mechanical, and thermal properties of package substrates | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.