Structures and methods to reduce maximum current density in a solder ball

US8674506B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Raschid J. Bezama · Mahopac, US
• Timothy H. Daubenspeck · Colchester, US
• Gary LaFontant · Elmont, US
• Ian D. Melville · Highland, US
• Ekta Misra · Hillsboro, US
• George J. Scott · Chandler, US
• Krystyna W. Semkow · Poughquag, US
• Timothy D. Sullivan · Batavia, US
• Robin A. Susko · Owego, US
• Thomas A. Wassick · Lagrangeville, US
• Xiaojin Wei · Poughkeepsie, US
• Steven L. Wright · Whitehall Corners, US

Key dates

• Filing date: Apr 30, 2013
• Grant date: Mar 18, 2014
• Expiry date: Apr 30, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Structures and methods to reduce maximum current density in a solder ball are disclosed. A method includes forming a contact pad in a last wiring level and forming a plurality of wires of the contact pad extending from side edges of the contact pad to respective ones of a plurality of vias. Each one of the plurality of wires has substantially the same electrical resistance.