Hideaki Tsugane
10Patents
4h-index
23Co-inventors
60Inventor score
Filing activity: Jan 11, 1996 → Sep 22, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6372554B1 | Semiconductor integrated circuit device and method for production of the same | Electricity | 77 | Expired |
| US5904556A | Method for making semiconductor integrated circuit device having interconnection structure using tungsten film | Electricity | 40 | Expired |
| US6780757B2 | Semiconductor integrated circuit device and method for making the same | Electricity | 12 | Expired |
| US6764945B2 | Method of manufacturing a multilayer metallization structure with non-directional sputtering method | Electricity | 6 | Expired |
| US7088001B2 | Semiconductor integrated circuit device with a metallization structure | Electricity | 2 | Expired |
| US6300237A | Semiconductor integrated circuit device and method for making the same | Electricity | 2 | Expired |
| US6583049B2 | Semiconductor integrated circuit device and method for making the same | Electricity | 2 | Expired |
| US7566662B2 | Method of dry cleaning silicon surface prior to forming self-aligned nickel silicide layer | Emerging Cross-Sectional Technologies | 1 | Active |
| US6538329B2 | Semiconductor integrated circuit device and method for making the same | Electricity | 0 | Expired |
| US9748081B2 | Method of manufacturing semiconductor device and sputtering apparatus | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.