II Kwon Shim
5Patents
4h-index
10Co-inventors
46Inventor score
Filing activity: Feb 14, 2006 → Jul 11, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8004095B2 | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer | Electricity | 42 | Active |
| US9449943B2 | Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern | Electricity | 7 | Active |
| US8704349B2 | Integrated circuit package system with exposed interconnects | Electricity | 7 | Active |
| US7986032B2 | Semiconductor package system with substrate having different bondable heights at lead finger tips | Electricity | 6 | Active |
| US8067272B2 | Integrated circuit package system for package stacking and manufacturing method thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.