Jack Eng
6Patents
3h-index
10Co-inventors
46Inventor score
Filing activity: Mar 28, 1995 → Oct 4, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6489660B1 | Low-voltage punch-through bi-directional transient-voltage suppression devices | Electricity | 39 | Expired |
| US5882986A | Semiconductor chips having a mesa structure provided by sawing | Electricity | 20 | Expired |
| US5640043A | High voltage silicon diode with optimum placement of silicon-germanium layers | Electricity | 6 | Expired |
| US6602769B2 | Low-voltage punch-through bi-directional transient-voltage suppression devices and methods of making the same | Electricity | 3 | Expired |
| US6248651A | Low cost method of fabricating transient voltage suppressor semiconductor devices or the like | Electricity | 1 | Expired |
| US5635414A | Low cost method of fabricating shallow junction, Schottky semiconductor devices | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.