John Commander
11Patents
4h-index
13Co-inventors
57Inventor score
Filing activity: Jul 23, 1990 → Aug 12, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5435898A | Alkaline zinc and zinc alloy electroplating baths and processes | Chemistry; Metallurgy | 23 | Expired |
| US7316772B2 | Defect reduction in electrodeposited copper for semiconductor applications | Electricity | 11 | Expired |
| US5578187A | Plating process for electroless nickel on zinc die castings | Chemistry; Metallurgy | 8 | Expired |
| US5061351A | Bright tin electrodeposition composition | Chemistry; Metallurgy | 7 | Expired |
| US11035048B2 | Cobalt filling of interconnects | Electricity | 3 | Active |
| US9222188B2 | Defect reduction in electrodeposited copper for semiconductor applications | Electricity | 2 | Active |
| US11124888B2 | Copper deposition in wafer level packaging of integrated circuits | Electricity | 0 | Active |
| US11434578B2 | Cobalt filling of interconnects in microelectronics | Chemistry; Metallurgy | 0 | Active |
| US11401618B2 | Cobalt filling of interconnects | Electricity | 0 | Active |
| US10995417B2 | Cobalt filling of interconnects in microelectronics | Chemistry; Metallurgy | 0 | Active |
| US11697884B2 | Copper deposition in wafer level packaging of integrated circuits | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.