John I. Kim
12Patents
6h-index
30Co-inventors
62Inventor score
Filing activity: Oct 17, 1991 → Aug 3, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5277749A | Methods and apparatus for relieving stress and resisting stencil delamination when performing lift-off processes that utilize high stress metals and/or multiple evaporation steps | Electricity | 69 | Expired |
| US7952831B2 | Perpendicular magnetic recording write head with notched trailing shield | Emerging Cross-Sectional Technologies | 13 | Active |
| US6539610B1 | Method for manufacturing a magnetic write head | Emerging Cross-Sectional Technologies | 9 | Expired |
| US7788797B2 | Method of making a perpendicular magnetic recording write head with notched trailing shield | Emerging Cross-Sectional Technologies | 7 | Active |
| US6723252B1 | Magnetic head P1 magnetic pole notching with reduced polymer deposition | Physics | 6 | Expired |
| US8066893B2 | Method for creating a magnetic write pole having a stepped perpendicular pole via CMP-assisted liftoff | Physics | 6 | Active |
| US6764551B2 | Process for removing dopant ions from a substrate | Performing Operations; Transporting | 2 | Expired |
| US7123443B2 | Self-aligned void filling for mushroomed plating | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6631546B1 | Self-aligned void filling for mushroomed plating | Emerging Cross-Sectional Technologies | 1 | Expired |
| US7340824B2 | Method for fabricating a magnetic head having an improved magnetic shield | Emerging Cross-Sectional Technologies | 1 | Expired |
| US8551347B2 | Methods for creating a stepped perpendicular magnetic pole via milling and/or metal liftoff | Emerging Cross-Sectional Technologies | 0 | Active |
| US7254884B2 | Method for fabricating a pole tip in a magnetic transducer using feed-forward and feedback | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.