JongVin Park
4Patents
2h-index
7Co-inventors
33Inventor score
Filing activity: May 30, 2008 → Jun 25, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8004093B2 | Integrated circuit package stacking system | Electricity | 35 | Active |
| US7683469B2 | Package-on-package system with heat spreader | Electricity | 24 | Active |
| US8310038B2 | Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof | Electricity | 2 | Active |
| US8569870B1 | Integrated circuit packaging system with shielding spacer and method of manufacture thereof | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.