Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof
US8310038B2 · kind B2 · utility
2Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2011 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Apr 20, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a package carrier; mounting an integrated circuit device to the package carrier; mounting an embeddable conductive structure, having a non-horizontal portion between a lower portion and an elevated portion and a hole, to the integrated circuit device with the lower portion over the integrated circuit device; mounting an interposer to the lower portion and below the elevated portion; and forming an encapsulation having a recess exposing the interposer and the elevated portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.