Package-on-package system with heat spreader
US7683469B2 · kind B2 · utility
24Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 2008 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | May 30, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package-on-package system includes: providing a base substrate; mounting an integrated circuit on the base substrate; positioning a stacking interposer over the integrated circuit; and forming a heat spreader base around the integrated circuit by coupling the base substrate and the stacking interposer to the heat spreader base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.