Integrated circuit packaging system with shielding spacer and method of manufacture thereof
US8569870B1 · kind B1 · utility
1Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2012 |
| Grant date | Oct 29, 2013 |
| Priority date | — |
| Expiry date | Jun 25, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a bottom integrated circuit over the substrate; connecting a bottom interconnect between the bottom integrated circuit and the substrate; and mounting a bottom shield-spacer above the bottom integrated circuit and the bottom shield-spacer includes a bottom shield plate above the bottom integrated circuit, a bottom shield pillar extending from a bottom shield foot and connected to the bottom shield plate, and a protuberance extending vertically above the bottom shield pillar and directly above the bottom shield foot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.