Inventor · Suwon-si, KR

Jun Mo Koo

43Patents
11h-index
39Co-inventors
75Inventor score

Filing activity: Apr 4, 1997 → Jun 6, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9224647B2 Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer Electricity 97 Active
US8993377B2 Semiconductor device and method of bonding different size semiconductor die at the wafer level Electricity 59 Active
US8288201B2 Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor die Electricity 50 Active
US8796137B2 Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect Electricity 43 Active
US5956367A Rake receiving apparatus for direct sequence code division multiple access system Electricity 21 Expired
US8009971B2 Hand-shake correction method and apparatus of camera module for use in mobile device Electricity 20 Active
US6009074A CDMA modulation and demodulation method reducing interference and a communication system using the same Electricity 19 Expired
US9337116B2 Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die Electricity 14 Active
US7489340B2 Optical image stabilizer for camera lens assembly Electricity 14 Active
US9875911B2 Semiconductor device and method of forming interposer with opening to contain semiconductor die Electricity 12 Active
US6516007B1 Method for synchronizing reverse link and transmission method using synchronous reverse link Electricity 11 Expired
US8236617B2 Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure Electricity 8 Active
US8866294B2 Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation Electricity 8 Active
US8642381B2 Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die Electricity 7 Active
US8241964B2 Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation Electricity 6 Active
US8435834B2 Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in FO-WLCSP Electricity 5 Active
US9142515B2 Semiconductor device with protective layer over exposed surfaces of semiconductor die Electricity 5 Active
US8999760B2 Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure Electricity 3 Active
US7979143B2 Apparatus and method for proportional-integral-derivative control Physics 2 Active
US9318441B2 Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die Electricity 2 Active
US9559039B2 Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package Electricity 2 Active
US9620455B2 Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure Electricity 1 Active
US9305854B2 Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package Electricity 1 Active
US9679824B2 Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP Electricity 1 Active
US11681085B2 Polarizing plate and optical display apparatus comprising the same Physics 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.