Method for planar electroplating

US7449098B1 · kind B1 · utility

Assignee

• Novellus Systems, Inc. · US

Inventors

• Steven T. Mayer · Lake Oswego, US
• Jonathan D. Reid · Sherwood, US
• Mark L. Rea · Tigard, US
• Ismail Emesh · Gilbert, US
• Henner Meinhold · Sandhausen, DE
• John Drewery · Santa Clara, US

Key dates

• Filing date: Dec 17, 2003
• Grant date: Nov 11, 2008
• Expiry date: Sep 4, 2025

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/76877
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A disclosed form of mechanically assisted electroplating leads to a flat, thin, overburden. In one example, an accelerator is deposited on a copper surface and mechanically removed in a simplified CMP-like apparatus. The wafer is then plated in an electrolyte containing little or no accelerating additives.