Autoclave capable chip-scale package
US8143729B2 · kind B2 · utility
3Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2009 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Jul 27, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power semiconductor package that includes a power semiconductor device having a threshold voltage that does not vary when subjected to an autoclave test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.