Michael E. Hess
36Patents
13h-index
8Co-inventors
70Inventor score
Filing activity: Nov 12, 1996 → Oct 6, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6578458B1 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Emerging Cross-Sectional Technologies | 290 | Expired |
| US5907492A | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Electricity | 60 | Expired |
| US6363295B1 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Electricity | 42 | Expired |
| US6553276B2 | Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Electricity | 37 | Expired |
| US6285203A | Test system having alignment member for aligning semiconductor components | Electricity | 34 | Expired |
| US6006739A | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Emerging Cross-Sectional Technologies | 33 | Expired |
| US6119675A | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Emerging Cross-Sectional Technologies | 24 | Expired |
| US6427676B2 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6250192A | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Emerging Cross-Sectional Technologies | 16 | Expired |
| US7155300B2 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Electricity | 16 | Expired |
| US6400174B2 | Test system having alignment member for aligning semiconductor components | Electricity | 16 | Expired |
| US7120513B1 | Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs | Electricity | 16 | Expired |
| US6296171A | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | Performing Operations; Transporting | 14 | Expired |
| US6155247A | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6045026A | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | Performing Operations; Transporting | 12 | Expired |
| US6401580B1 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6691696B2 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6998334B2 | Semiconductor devices with permanent polymer stencil and method for manufacturing the same | Electricity | 10 | Expired |
| US6417685B1 | Test system having alignment member for aligning semiconductor components | Electricity | 10 | Expired |
| US6196096A | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6687990B2 | Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6419143B2 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | Performing Operations; Transporting | 4 | Expired |
| US6255196A | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6427899B2 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | Performing Operations; Transporting | 3 | Expired |
| US6459105B2 | Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions | Emerging Cross-Sectional Technologies | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.