Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby
US6687990B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2002 |
| Grant date | Feb 10, 2004 |
| Priority date | — |
| Expiry date | Aug 20, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/7868
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades are disclosed. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices. The wafer saw may also be used to simultaneously sever and electrically isolate conductive traces that extend over adjacent semiconductor devices from connective lines therefor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.