Semiconductor devices with permanent polymer stencil and method for manufacturing the same
US6998334B2 · kind B2 · utility
10Cited by
25References
73Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2002 |
| Grant date | Feb 14, 2006 |
| Priority date | — |
| Expiry date | Oct 27, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of manufacturing semiconductor devices using permanent or temporary polymer layers having apertures to expose contact pads and cover the active surfaces of the semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.