Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
US6427676B2 · kind B2 · utility
17Cited by
57References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2001 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | Jan 2, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/7868
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.