Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
US6427899B2 · kind B2 · utility
3Cited by
28References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2001 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | Aug 3, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/38
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.