Michael W. DeVre
6Patents
5h-index
12Co-inventors
52Inventor score
Filing activity: Mar 18, 1994 → Jul 31, 1998
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5532512A | Direct stacked and flip chip power semiconductor device structures | Electricity | 214 | Expired |
| US6071822A | Etching process for producing substantially undercut free silicon on insulator structures | Electricity | 47 | Expired |
| US5576925A | Flexible multilayer thin film capacitors | Electricity | 38 | Expired |
| US5431963A | Method for adhering diamondlike carbon to a substrate | Emerging Cross-Sectional Technologies | 14 | Expired |
| US5569487A | Capacitor dielectrics of silicon-doped amorphous hydrogenated carbon | Electricity | 8 | Expired |
| US5643637A | Method of grading the electric field of an electrode | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.