Minjun Bae
9Patents
1h-index
10Co-inventors
40Inventor score
Filing activity: Mar 13, 2019 → Feb 27, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10950539B2 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Electricity | 4 | Active |
| US11264354B2 | Wafer level package | Electricity | 1 | Active |
| US11948872B2 | Semiconductor package and method of fabricating the same | Electricity | 1 | Active |
| US12230556B2 | Semiconductor package and method of fabricating the same | Electricity | 0 | Active |
| US11894338B2 | Wafer level package | Electricity | 0 | Active |
| US12160005B2 | Black metallic nanorod arrays and method of manufacturing thereof | Emerging Cross-Sectional Technologies | 0 | Active |
| US11600564B2 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Electricity | 0 | Active |
| US11973028B2 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Electricity | 0 | Active |
| US12014975B2 | Semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.