Ruopeng Deng
5Patents
1h-index
11Co-inventors
37Inventor score
Filing activity: Jul 31, 2019 → Aug 10, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11972952B2 | Atomic layer deposition on 3D NAND structures | Electricity | 1 | Active |
| US12014928B2 | Multi-layer feature fill | Electricity | 1 | Active |
| US12060639B2 | Rapid flush purging during atomic layer deposition | Electricity | 0 | Active |
| US12237221B2 | Nucleation-free tungsten deposition | Electricity | 0 | Active |
| US12077858B2 | Tungsten deposition | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.