Satoshi Oka
19Patents
6h-index
23Co-inventors
66Inventor score
Filing activity: Feb 28, 1973 → Nov 18, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD327868S | Combined car-mount unit and power supply adapter for a digital audio tape recorder | General | 88 | Expired |
| US3930924A | Process for making identification cards | Emerging Cross-Sectional Technologies | 39 | Expired |
| US7029977B2 | Fabrication method of semiconductor wafer | Electricity | 26 | Expired |
| US6139625A | Method for producing a silicon single crystal wafer and a silicon single crystal wafer | Chemistry; Metallurgy | 16 | Expired |
| USD331385S | Combined power supply adapter and converter for a digital audio tape recorder | General | 15 | Expired |
| US6531416B1 | Method for heat treatment of silicon wafer and silicon wafer heat-treated by the method | Emerging Cross-Sectional Technologies | 7 | Expired |
| USD318278S | Combined radio and tape player | General | 6 | Expired |
| US5763838A | Apparatus for weighing a grown crystal | Emerging Cross-Sectional Technologies | 4 | Expired |
| US5759426A | Heat treatment jig for semiconductor wafers and a method for treating a surface of the same | Chemistry; Metallurgy | 3 | Expired |
| US6403502B1 | Heat treatment method for a silicon wafer and a silicon wafer heat-treated by the method | Emerging Cross-Sectional Technologies | 3 | Expired |
| US8728912B2 | Method for manufacturing SOI wafer | Electricity | 1 | Active |
| USD334190S | Digital audio tape recorder | General | 1 | Expired |
| US8691665B2 | Method for producing bonded wafer | Electricity | 1 | Active |
| US8823130B2 | Silicon epitaxial wafer, method for manufacturing the same, bonded SOI wafer and method for manufacturing the same | Electricity | 1 | Active |
| US7838388B2 | Method for producing SOI substrate | Electricity | 1 | Active |
| US7008881B2 | Method for forming silicon epitaxial layer | Chemistry; Metallurgy | 1 | Expired |
| US8076223B2 | Method for producing semiconductor substrate | Electricity | 0 | Active |
| US8497187B2 | Method for manufacturing SOI wafer and SOI wafer | Electricity | 0 | Active |
| US8389382B2 | Method for manufacturing bonded wafer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.