Shi YOU
6Patents
1h-index
13Co-inventors
37Inventor score
Filing activity: Jun 7, 2019 → Feb 10, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11164780B2 | Process integration approach for selective metal via fill | Electricity | 1 | Active |
| US11923244B2 | Subtractive metals and subtractive metal semiconductor structures | Electricity | 0 | Active |
| US12046508B2 | Method of dielectric material fill and treatment | Electricity | 0 | Active |
| US11094588B2 | Interconnection structure of selective deposition process | Electricity | 0 | Active |
| US11615984B2 | Method of dielectric material fill and treatment | Electricity | 0 | Active |
| US11515200B2 | Selective tungsten deposition within trench structures | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.