SinJae Lee
11Patents
6h-index
7Co-inventors
51Inventor score
Filing activity: May 30, 2008 → Apr 28, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8004093B2 | Integrated circuit package stacking system | Electricity | 35 | Active |
| US7683469B2 | Package-on-package system with heat spreader | Electricity | 24 | Active |
| US8343810B2 | Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers | Electricity | 15 | Active |
| US8003496B2 | Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die | Electricity | 14 | Active |
| US8836114B2 | Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers | Electricity | 13 | Active |
| US8531012B2 | Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV | Electricity | 9 | Active |
| US9401347B2 | Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV | Electricity | 5 | Active |
| US9379064B2 | Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die | Electricity | 4 | Active |
| US9048209B2 | Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die | Electricity | 2 | Active |
| US8569870B1 | Integrated circuit packaging system with shielding spacer and method of manufacture thereof | Electricity | 1 | Active |
| US8937371B2 | Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.