Patent · US Active

Integrated circuit structures in package substrates

US10672693B2 · kind B2 · utility

2Cited by

0References

21Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Sanka Ganesan · Chandler, US
William J. Lambert · Chandler, US
Zhichao Zhang · Chandler, US
Sri Chaitra Jyotsna Chavali · Chandler, US
Stephen Andrew Smith · Co-op Village, US
Michael J. Hill · Gilbert, US
Zhenguo Jiang · Chandler, US

Key dates

Filing date	Apr 3, 2018
Grant date	Jun 2, 2020
Priority date	—
Expiry date	Apr 3, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01P3/085
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.