Patent · US Active

Integrated circuit structures in package substrates

US11804426B2 · kind B2 · utility

0Cited by

0References

12Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Sanka Ganesan · Chandler, US
William J. Lambert · Chandler, US
Zhichao Zhang · Chandler, US
Sri Chaitra Jyotsna Chavali · Chandler, US
Stephen Andrew Smith · Co-op Village, US
Michael J. Hill · Gilbert, US
Zhenguo Jiang · Chandler, US

Key dates

Filing date	Jul 19, 2021
Grant date	Oct 31, 2023
Priority date	—
Expiry date	Aug 5, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01P3/085
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.