Process for fabricating a low dielectric composite substrate

US5135595A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• John Acocella · Hopewell Junction, US
• Peter A. Agostino · Canaan, US
• Arnold I. Baise · Poughkeepsie, US
• Richard A. Bates · Wappingers Falls, US
• Ray M. Bryant · Poughquag, US
• Jon A. Casey · Poughkeepsie, US
• David R. Clarke · Katonah, US
• George Czornyj · Wappingers Falls, US
• Allen J. Dam · Pine Plains, US
• Lawrence D. David · Durham, US
• Renuka S. Divakaruni · Ridgefield, US
• Werner E. Dunkel · Lagrangeville, US
• Ajay P. Giri · Poughkeepsie, US
• Liang-Choo Hsia · Singapore, SG
• James N. Humenik · Lagrangeville, US
• Steven M. Kandetzke · Fishkill, US
• Daniel P. Kirby · Poughkeepsie, US
• John U. Knickerbocker · Wappingers Falls, US
• Sarah H. Knickerbocker · Hopewell Junction, US
• Anthony Mastreani · Hopewell Junction, US
• Amy T. Matts · Poughkeepsie, US
• Robert W. Nufer · Hopewell Junction, US
• Charles H. Perry · Poughkeepsie, US
• Srinivasa S. N. Reddy · Lagrangeville, US
• Salvatore J. Scilla · Marlboro, US
• Mark A. Takacs · Poughkeepsie, US
• Lovell B. Wiggins · Hopewell Junction, US

Key dates

• Filing date: Mar 30, 1990
• Grant date: Aug 4, 1992
• Expiry date: Mar 30, 2010

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/308
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.