Inventor · Zhubei City, TW

Su-Jen Sung

29Patents
4h-index
24Co-inventors
59Inventor score

Filing activity: Feb 7, 2007 → Nov 9, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9852905B2 Systems and methods for uniform gas flow in a deposition chamber Electricity 6 Active
US10163794B2 Capping layer for improved deposition selectivity Electricity 6 Active
US8084357B2 Method for manufacturing a dual damascene opening comprising a trench opening and a via opening Electricity 5 Active
US9041216B2 Interconnect structure and method of forming the same Electricity 5 Active
US9396990B2 Capping layer for improved deposition selectivity Electricity 3 Active
US7947565B2 Forming method of porous low-k layer and interconnect process Emerging Cross-Sectional Technologies 3 Active
US9530728B2 Semiconductor devices and methods of manufacture thereof Electricity 2 Active
US10510666B2 Interconnect structure and method of forming same Electricity 2 Active
US9490209B2 Electro-migration barrier for Cu interconnect Electricity 2 Active
US8350246B2 Structure of porous low-k layer and interconnect structure Emerging Cross-Sectional Technologies 1 Active
US9129965B2 Semiconductor devices and methods of manufacture thereof Electricity 1 Active
US9355894B2 Interconnect structure and method of forming the same Electricity 0 Active
US10867920B2 Electro-migration barrier for Cu interconnect Electricity 0 Active
US11670546B2 Semiconductor structure and manufacturing method thereof Electricity 0 Active
US12211766B2 Highly protective wafer edge sidewall protection layer Electricity 0 Active
US12094930B2 Integrated circuit structure and method for forming the same Electricity 0 Active
US12046557B2 Interconnect structure and method of forming same Electricity 0 Active
US11515255B2 Electro-migration barrier for interconnect Electricity 0 Active
US11532548B2 Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect Electricity 0 Active
US10163795B2 Electro-migration barrier for Cu interconnect Electricity 0 Active
US11502035B2 Interconnect structure and method of forming same Electricity 0 Active
US12255095B2 Semiconductor structure and manufacturing method thereof Electricity 0 Active
US11923304B2 Electro-migration barrier for interconnect Electricity 0 Active
US11282742B2 Semiconductor device with multi-layer etch stop structure and method for forming the same Electricity 0 Active
US11264328B2 Capping layer for improved deposition selectivity Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.