Tauman T. Lau
14Patents
4h-index
13Co-inventors
57Inventor score
Filing activity: May 8, 2002 → Sep 30, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6836026B1 | Integrated circuit design for both input output limited and core limited integrated circuits | Electricity | 33 | Expired |
| US6798069B1 | Integrated circuit having adaptable core and input/output regions with multi-layer pad trace conductors | Electricity | 11 | Expired |
| US6963138B2 | Dielectric stack | Electricity | 10 | Expired |
| US7863716B2 | Method and apparatus of power ring positioning to minimize crosstalk | Electricity | 4 | Active |
| US8115321B2 | Separate probe and bond regions of an integrated circuit | Electricity | 2 | Active |
| US6768142B2 | Circuit component placement | Electricity | 2 | Expired |
| US7569472B2 | Method and apparatus of power ring positioning to minimize crosstalk | Electricity | 2 | Active |
| US6998638B2 | Test structure for detecting bonding-induced cracks | Electricity | 2 | Expired |
| US6781150B2 | Test structure for detecting bonding-induced cracks | Electricity | 2 | Expired |
| US6784102B2 | Laterally interconnecting structures | Electricity | 2 | Expired |
| US7328417B2 | Cell-based method for creating slotted metal in semiconductor designs | Electricity | 1 | Expired |
| US7737564B2 | Power configuration method for structured ASICs | Electricity | 0 | Expired |
| US6683476B2 | Contact ring architecture | Electricity | 0 | Expired |
| US11538790B2 | Extended HBM offsets in 2.5D interposers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.