Vignesh Sundar
41Patents
4h-index
18Co-inventors
52Inventor score
Filing activity: Apr 5, 2017 → Aug 9, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9935261B1 | Dielectric encapsulation layer for magnetic tunnel junction (MTJ) devices using radio frequency (RF) sputtering | Electricity | 12 | Active |
| US10522746B1 | Dual magnetic tunnel junction devices for magnetic random access memory (MRAM) | Physics | 11 | Active |
| US10797225B2 | Dual magnetic tunnel junction (DMTJ) stack design | Electricity | 9 | Active |
| US10516100B2 | Silicon oxynitride based encapsulation layer for magnetic tunnel junctions | Electricity | 6 | Active |
| US10665773B2 | Nitride capping layer for spin torque transfer (STT)-magnetoresistive random access memory (MRAM) | Electricity | 4 | Active |
| US10297746B2 | Post treatment to reduce shunting devices for physical etching process | Electricity | 4 | Active |
| US11417835B2 | Nitride capping layer for spin torque transfer (STT) magnetoresistive random access memory (MRAM) | Electricity | 3 | Active |
| US10522745B2 | Low resistance MgO capping layer for perpendicularly magnetized magnetic tunnel junctions | Electricity | 3 | Active |
| US10522749B2 | Combined physical and chemical etch to reduce magnetic tunnel junction (MTJ) sidewall damage | Electricity | 3 | Active |
| US11043632B2 | Ion beam etching process design to minimize sidewall re-deposition | Electricity | 2 | Active |
| US11430945B2 | MTJ device performance by adding stress modulation layer to MTJ device structure | Physics | 2 | Active |
| US10622047B2 | Free layer structure in magnetic random access memory (MRAM) for Mo or W perpendicular magnetic anisotropy (PMA) enhancing layer | Electricity | 2 | Active |
| US10115892B2 | Multilayer structure for reducing film roughness in magnetic devices | Electricity | 2 | Active |
| US10797232B2 | Low resistance MgO capping layer for perpendicularly magnetized magnetic tunnel junctions | Electricity | 2 | Active |
| US10784310B2 | Cooling for PMA (perpendicular magnetic anisotropy) enhancement of STT-MRAM (spin torque transfer-magnetic random access memory) devices | Electricity | 1 | Active |
| US11444241B2 | Self-aligned encapsulation hard mask to separate physically under-etched MTJ cells to reduce conductive R-deposition | Electricity | 1 | Active |
| US10950782B2 | Nitride diffusion barrier structure for spintronic applications | Electricity | 1 | Active |
| US11696511B2 | Low resistance MgO capping layer for perpendicularly magnetized magnetic tunnel junctions | Electricity | 1 | Active |
| US10475987B1 | Method for fabricating a magnetic tunneling junction (MTJ) structure | Physics | 1 | Active |
| US10868237B2 | Self-aligned encapsulation hard mask to separate physically under-etched MTJ cells to reduce conductive R-deposition | Electricity | 1 | Active |
| US11818961B2 | Self-aligned encapsulation hard mask to separate physically under-etched MTJ cells to reduce conductive re-deposition | Electricity | 1 | Active |
| US11424405B2 | Post treatment to reduce shunting devices for physical etching process | Electricity | 0 | Active |
| US12027191B2 | Free layer structure in magnetic random access memory (MRAM) for Mo or W perpendicular magnetic anisotropy (PMA) enhancing layer | Electricity | 0 | Active |
| US11087810B2 | Free layer structure in magnetic random access memory (MRAM) for Mo or W perpendicular magnetic anisotropy (PMA) enhancing layer | Electricity | 0 | Active |
| US11785864B2 | MTJ device performance by adding stress modulation layer to mtj device structure | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.