Warren L. Boyer
6Patents
2h-index
3Co-inventors
33Inventor score
Filing activity: Nov 13, 2017 → Oct 2, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10483241B1 | Semiconductor devices with through silicon vias and package-level configurability | Electricity | 6 | Active |
| US10283462B1 | Semiconductor devices with post-probe configurability | Electricity | 4 | Active |
| US10867991B2 | Semiconductor devices with package-level configurability | Electricity | 1 | Active |
| US10403585B2 | Semiconductor devices with post-probe configurability | Electricity | 1 | Active |
| US10811372B2 | Semiconductor devices with post-probe configurability | Electricity | 0 | Active |
| US11056467B2 | Semiconductor devices with through silicon vias and package-level configurability | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.