Semiconductor devices with package-level configurability
US10867991B2 · kind B2 · utility
1Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2018 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Dec 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30205
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to the first contact pad, and the substrate is electrically isolated from the second contact pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.