Wayne P. Richling
6Patents
4h-index
7Co-inventors
50Inventor score
Filing activity: Jul 31, 1984 → Nov 24, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4566193A | Use of an electronic vernier for evaluation of alignment in semiconductor processing | Physics | 15 | Expired |
| US7208843B2 | Routing design to minimize electromigration damage to solder bumps | Electricity | 13 | Expired |
| US4992840A | Carbon doping MOSFET substrate to suppress hit electron trapping | Electricity | 13 | Expired |
| US7253528B2 | Trace design to minimize electromigration damage to solder bumps | Electricity | 5 | Expired |
| US9859205B2 | Semiconductor device having an airbridge and method of fabricating the same | Electricity | 0 | Active |
| US8962443B2 | Semiconductor device having an airbridge and method of fabricating the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.