Wei Tang
7Patents
3h-index
11Co-inventors
46Inventor score
Filing activity: Feb 25, 2015 → May 14, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9425078B2 | Inhibitor plasma mediated atomic layer deposition for seamless feature fill | Electricity | 434 | Active |
| US9966299B2 | Inhibitor plasma mediated atomic layer deposition for seamless feature fill | Electricity | 348 | Active |
| US11049716B2 | Gap fill using carbon-based films | Electricity | 11 | Active |
| US9786496B2 | Method of densifying films in semiconductor device | Electricity | 1 | Active |
| US9406544B1 | Systems and methods for eliminating seams in atomic layer deposition of silicon dioxide film in gap fill applications | Electricity | 1 | Active |
| US12269924B2 | Polyimide film and manufacturing method thereof | Chemistry; Metallurgy | 0 | Active |
| US9966255B2 | Method of densifying films in semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.