William Brezinski
5Patents
1h-index
10Co-inventors
37Inventor score
Filing activity: Sep 26, 2019 → Jun 27, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11289421B2 | Methods and structures for improved electrical contact between bonded integrated circuit interfaces | Electricity | 1 | Active |
| US11887887B2 | Interconnect structures and methods of fabrication | Electricity | 0 | Active |
| US11532558B2 | Metallization barrier structures for bonded integrated circuit interfaces | Electricity | 0 | Active |
| US11784123B2 | Methods and structures for improved electrical contact between bonded integrated circuit interfaces | Electricity | 0 | Active |
| US11404307B2 | Interconnect structures and methods of fabrication | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.