William J. Patrick
8Patents
8h-index
26Co-inventors
65Inventor score
Filing activity: May 27, 1975 → Mar 7, 1989
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4789648A | Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias | Electricity | 413 | Expired |
| US4944836A | Chem-mech polishing method for producing coplanar metal/insulator films on a substrate | Electricity | 382 | Expired |
| US4954142A | Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor | Electricity | 218 | Expired |
| US4717596A | Method for vacuum vapor deposition with improved mass flow control | Chemistry; Metallurgy | 90 | Expired |
| US4437922A | Method for tailoring oxygen precipitate particle density and distribution silicon wafers | Emerging Cross-Sectional Technologies | 61 | Expired |
| US4640221A | Vacuum deposition system with improved mass flow control | Chemistry; Metallurgy | 59 | Expired |
| US4040895A | Control of oxygen in silicon crystals | Emerging Cross-Sectional Technologies | 19 | Expired |
| US4010064A | Controlling the oxygen content of Czochralski process of silicon crystals by sandblasting silica vessel | Emerging Cross-Sectional Technologies | 16 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.