Wim Besling
5Patents
3h-index
4Co-inventors
42Inventor score
Filing activity: Nov 24, 2005 → May 31, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7867889B2 | Method of forming an interconnect structure on an integrated circuit die | Electricity | 13 | Active |
| US7928006B2 | Structure for a semiconductor device and a method of manufacturing the same | Electricity | 13 | Active |
| US8138082B2 | Method for forming metal interconnects in a dielectric material | Electricity | 6 | Active |
| US8349726B2 | Method for fabricating a structure for a semiconductor device using a halogen based precursor | Electricity | 3 | Active |
| US8830656B2 | High density capacitor | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.