Zhenjiang Cui
9Patents
2h-index
30Co-inventors
47Inventor score
Filing activity: May 6, 2003 → Jun 11, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6693050B1 | Gapfill process using a combination of spin-on-glass deposition and chemical vapor deposition techniques | Electricity | 37 | Expired |
| US7030041B2 | Adhesion improvement for low k dielectrics | Electricity | 34 | Expired |
| US10692880B2 | 3D NAND high aspect ratio structure etch | Electricity | 0 | Active |
| US9318383B2 | Integrated cluster to enable next generation interconnect | Electricity | 0 | Active |
| US10696426B2 | Menu-type design method for GEO satellite control system based on optimized information integration | Performing Operations; Transporting | 0 | Active |
| US9184093B2 | Integrated cluster to enable next generation interconnect | Electricity | 0 | Active |
| US9312168B2 | Air gap structure integration using a processing system | Electricity | 0 | Active |
| US10504746B2 | HKMG integration | Electricity | 0 | Active |
| US11239091B2 | Etching of metal oxides using fluorine and metal halides | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.