Zuopeng He
5Patents
1h-index
8Co-inventors
36Inventor score
Filing activity: May 27, 2015 → Jan 22, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9754893B2 | Semiconductor structure and fabrication method thereof | Electricity | 5 | Active |
| US11538686B2 | Semiconductor structure and method for forming the same | Electricity | 1 | Active |
| US11373949B2 | Interconnect structure having metal layers enclosing a dielectric | Electricity | 0 | Active |
| US10553536B2 | Method of manufacturing an interconnect structure by forming metal layers in mask openings | Electricity | 0 | Active |
| US9607895B2 | Silicon via with amorphous silicon layer and fabrication method thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.