Patent · US Active

Method for handling a product substrate, a bonded substrate system and a temporary adhesive

US10056295B2 · kind B2 · utility

0Cited by

2References

11Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Georg Meyer-Berg · Birkenfeld, DE
Claus von Waechter · Sinzing, DE
Michael Bauer · Nittendorf, DE
Holger Doepke · Sinzing, DE
Dominic Maier · Pleystein, DE
Daniel Porwol · Straubing, DE
Tobias Schmidt · Munich, DE

Key dates

Filing date	Jan 20, 2016
Grant date	Aug 21, 2018
Priority date	—
Expiry date	Jan 27, 2036

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S156/941
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for handling a product substrate includes bonding a carrier to the product substrate. A layer of a permanent adhesive is applied onto a surface of the carrier. A structured intermediate layer is provided. The applied permanent adhesive bonds the carrier to the product substrate. The structured intermediate layer is arranged between the product substrate and the carrier. A surface of the structured intermediate layer and a surface of the permanent adhesive are in direct contact to a surface of the product substrate. The structured intermediate layer decreases a bonding strength between the product substrate and the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.