Automated optical inspection of unit specific patterning
US10056304B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2017 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | May 18, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An automated optical inspection (AOI) system can comprise aligning a wafer comprising a plurality of unit specific patterns. A plurality of unique reference standards can be created as a plurality of electrical nets by generating with a computer an electrical net for each of the unit specific patterns, each of the plurality of electrical nets comprising a start point and an end point. An image of each of the plurality of unit specific patterns can be captured with a camera. The image can be processed with the computer to provide a plurality of extracted boundaries of contiguous electrically conductive regions. Defects in the plurality of unit specific patterns, if present, can be detected by comparing each of the extracted boundaries of contiguous electrically conductive regions to a corresponding one of the plurality of unique reference standards. An output of known good die can be created.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.