Patent · US Active

Micromechanical structure and method for fabricating the same

US10081533B2 · kind B2 · utility

1Cited by

0References

39Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ulrich Schmid · Wien, AT
Tobias Frischmuth · Wien, AT
Peter Irsigler · Ried im Innkreis, AT
Thomas Grille · Villach, AT
Daniel Maurer · Feld am See, AT
Ursula Hedenig · Villach, AT
Markus Kahn · Rangersdorf, AT
Günter Denifl · Annenheim, AT

Key dates

Filing date	Jul 31, 2014
Grant date	Sep 25, 2018
Priority date	—
Expiry date	May 23, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH04R2499/11
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A micromechanical structure includes a substrate and a functional structure arranged at the substrate. The functional structure has a functional region configured to deflect with respect to the substrate responsive to a force acting on the functional region. The functional structure includes a conductive base layer and a functional structure comprising a stiffening structure having a stiffening structure material arranged at the conductive base layer and only partially covering the conductive base layer at the functional region. The stiffening structure material includes a silicon material and at least a carbon material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.