Feed-forward of multi-layer and multi-process information using XPS and XRF technologies
US10082390B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2015 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | Sep 16, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N23/22
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and systems for feed-forward of multi-layer and multi-process information using XPS and XRF technolgies are disclosed. In an example, a method of thin film characterization includes measuring first XPS and XRF intensity signals for a sample having a first layer above a substrate. A thickness of the first layer is determined based on the first XPS and XRF intensity signals. The information for the first layer and for the substrate is combined to estimate an effective substrate. Second XPS and XRF intensity signals are measured for a sample having a second layer above the first layer above the substrate. The method also involves determining a thickness of the second layer based on the second XPS and XRF intensity signals, the thickness accounting for the effective substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.