Michael Kwan
14Patents
6h-index
29Co-inventors
66Inventor score
Filing activity: Jul 27, 1998 → Jun 8, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6335288B1 | Gas chemistry cycling to achieve high aspect ratio gapfill with HDP-CVD | Emerging Cross-Sectional Technologies | 317 | Expired |
| US7253123B2 | Method for producing gate stack sidewall spacers | Electricity | 240 | Expired |
| US6045877A | Pyrolytic chemical vapor deposition of silicone films | Physics | 148 | Expired |
| US7407893B2 | Liquid precursors for the CVD deposition of amorphous carbon films | Electricity | 21 | Expired |
| US7638440B2 | Method of depositing an amorphous carbon film for etch hardmask application | Physics | 20 | Active |
| US6812153B2 | Method for high aspect ratio HDP CVD gapfill | Electricity | 7 | Expired |
| US7052552B2 | Gas chemistry cycling to achieve high aspect ratio gapfill with HDP-CVD | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6596123B1 | Method and apparatus for cleaning a semiconductor wafer processing system | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6715496B2 | Method and apparatus for cleaning a semiconductor wafer processing system | Emerging Cross-Sectional Technologies | 4 | Expired |
| US10082390B2 | Feed-forward of multi-layer and multi-process information using XPS and XRF technologies | Physics | 2 | Active |
| US10648802B2 | Feed-forward of multi-layer and multi-process information using XPS and XRF technologies | Physics | 2 | Active |
| US11029148B2 | Feed-forward of multi-layer and multi-process information using XPS and XRF technologies | Physics | 1 | Active |
| US7064077B2 | Method for high aspect ratio HDP CVD gapfill | Electricity | 1 | Expired |
| US11733035B2 | Feed-forward of multi-layer and multi-process information using XPS and XRF technologies | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.