Semiconductor device and method of manufacturing thereof
US10157872B2 · kind B2 · utility
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20Claims
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Assignee
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Key dates
| Filing date | Jul 13, 2018 |
| Grant date | Dec 18, 2018 |
| Priority date | — |
| Expiry date | Jul 13, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/94
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing a semiconductor device comprising forming interconnection structures by at least part performing a lateral plating process, and a semiconductor device manufactured thereby.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.