Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
US10160092B2 · kind B2 · utility
3Cited by
10References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2013 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Dec 31, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.