Thin heated substrate support
US10204805B2 · kind B2 · utility
9Cited by
11References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2016 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Dec 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to an apparatus for heating and supporting a substrate in a processing chamber. A substrate support assembly includes a heated plate having a substrate supporting surface on a front side and a cantilever arm extending from a backside of the heated plate. The heated plate is configured to support and heat a substrate on the substrate supporting surface. The cantilever arm has a first end attached to the heated plate near a central axis of the heated plate, and a second end extending radially outwards from the central axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.