Shadow ring for modifying wafer edge and bevel deposition

US10227695B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Dale R. Du Bois · Los Gatos, US
• Mohamad A. Ayoub · Los Gatos, US
• Robert W. Kim · Mountain View, US
• Amit Kumar BANSAL · Milpitas, US
• Mark Fodor · Los Gatos, US
• Binh Nguyen · Cupertino, US
• Siu F. Cheng · Culver City, US
• Hang Yu · Woodland, US
• Chiu Chan · Foster City, US
• Ganesh Balasubramanian · Sunnyvale, US
• Deenesh Padhi · Sunnyvale, US
• Juan Carlos Rocha · Redwood City, US

Key dates

• Filing date: Dec 21, 2010
• Grant date: Mar 12, 2019
• Expiry date: May 28, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68735
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Embodiments of the invention contemplate a shadow ring that provides increased or decreased and more uniform deposition on the edge of a wafer. By removing material from the top and/or bottom surfaces of the shadow ring, increased edge deposition and bevel coverage can be realized. In one embodiment, the material on the bottom surface is reduced by providing a recessed slot on the bottom surface. By increasing the amount of material of the shadow ring, the edge deposition and bevel coverage is reduced. Another approach to adjusting the deposition at the edge of the wafer includes increasing or decreasing the inner diameter of the shadow ring. The material forming the shadow ring may also be varied to change the amount of deposition at the edge of the wafer.